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27, 2020 /PRNewswire/ -- A news report by China.org.cn on China moves closer to self-reliance in 7nm chip production. China has recently made new breakthroughs in its 7nm chip-making process, reportedly developing tools and know-how for several segments of the manufacturing process amid efforts to reduce reliance on foreign equipment and material vendors. An exhibition booth of China's Semiconductor Manufacturing International Corporation (SMIC) is seen at the 17th China International Semiconductor Expo in Shanghai, Sept. 3, 2019. [Photo/CFP] Last month, China's chip customization solution provider Innosilicon announced that it had taped out and completed testing of a prototype chip based on the FinFET N+1 process of Semiconductor Manufacturing International Corporation (SMIC). This achievement marks a new step forward in China's homegrown chip development. Amid major trade restrictions enforced by the United States, SMIC's new generation foundry node is said to be comparable to the 7nm process by Taiwan Semiconductor Manufacturing Company (TSMC), the world's largest dedicated independent find out semiconductor foundry. As China's largest chip foundry, SMIC will introduce its N+1 7nm node, marking a significant improvement over its current 14 nm production node, boasting a 20% increase in performance, power consumption reduction of 57%, a reduced logic area of 63%, and SoC (System on a Chip) area reduction of 55%, according to the company. Moreover, the N+1 foundry node may enable SMIC to break its reliance on advanced Extreme Ultraviolet (EUV) lithography machines produced by Dutch microchip machine maker ASML, according to Liang Mengsong, co-CEO of SMIC. ASML is subject to U.S. export controls as its products contain American technology.

https://www.prnewswire.com/il/news-releases/china-moves-closer-to-self-reliance-in-7nm-chip-production-822983467.html

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